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M-Audio’s new SynchroScience product development group is all about providing DJs with the tools they need – as evidenced by the portable and powerful Conectiv interface. With two pairs of stereo inputs and outputs, easy USB connectivity and included Torq DJ software, Conectiv can turn any compatible Mac or PC into a powerful DJ rig. Apr 25,  · Released more than ten years ago, the Synchroscience by M Audio Conectiv USB audio interface originally sold with the Torq system can be re-purposed with a R. Install M-Audio Conectiv 6_0_: Applies To: Conectiv: Operating Systems: Windows XP SP3 Windows Vista (Bit) SP1 Windows Vista (Bit) SP2 Windows Vista (Bit) Windows Vista (Bit) SP1 Windows Vista (Bit) SP2 Windows 7 (Bit) Windows 7 (Bit) SP1 Windows 7 (Bit) Windows 7 (Bit) SP1: Version: Release Date: 02/

 

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Acclaimed audio interfaces, studio monitors, and keyboard controllers. Sep 09,  · Conectiv, developed by M-Audio’s SynchroScience division, is the world’s first bus-powered 4 x 4 USB audio interface designed for DJs who perform and produce tracks with a laptop/ Manufacturers of MIDI and audio devices for the PC or Mac. Product catalog, company information, news and support center.
 
 
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M-Audio Audio Interface Conectiv User Manual
Description
M-Audio CONECTIV Torq Dj Software | ProSound and Stage Lighting
M-Audio Conectiv USB DJ Audio Interface
Product Specifications

 

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TSMC prepares for 45nm production

Striving to take the lead in the contract manufacturing market and keep up with Intel, Taiwan’s TSMC (Taiwan Semiconductor Manufacturing Co.) yesterday presented some details of its new 45nm technological process, which will be provided to the company’s customers in 2021, in which, we recall, the start of production of the first 45nm Intel processors is planned.

And although some of the solutions inherent in 65-nm production processes may be retained in 45-nm technologies, they will have to be abandoned in the future, since for them 45-nm norms will become a kind of “watershed”: we are talking about dielectrics with a large dielectric constant (high-k) and metal gates. By the time of the transition to 32 nm standards, these two technologies will disappear into oblivion, and others will take their place.

Initially, TSMC will offer its customers low voltage 45nm process options. “Risky” production can be carried out already in the third quarter of next year. In the future, other options for 45nm technology will be offered.

Currently TSMC’s 45nm process contains 10 metallized layers, the gate length does not exceed 26nm. The conductors are made of copper, a triple layer of silicon oxide is created in the gate area, strained silicon is used, and a new generation of dielectrics with a low dielectric constant (low-k). 193-nm immersion lithographic tools manufactured by ASML are used for the production of microcircuits in compliance with the 45-nm technical process. Dielectric constant of low-k film is 2.5-2.6. By comparison, 90nm and 65nm processes use low-k dielectrics with a dielectric constant of 2.9-3.0. Films are sprayed using Applied Materials Black Diamond technology.

At the same time, like other semiconductor IC manufacturers, TSMC is researching the possibility of using high-k insulators in 45nm process technology, which would simplify and reduce the cost of the transition to new standards. However, observers rate the chances of using outdated technology in a new process as “low enough”.